PCB / FPC Laser Depaneling

Category

Contact Us

YUSH Electronic Technology Co.,Ltd.
Contacts:Eva Liu +86 13416743702
Tel:86-0512-62751429
Skype:evaliuhuan

Email:sales@yushunli.com evaliu@hk-yush.com

Website: http://www.pcbcutter.com

Company Address:3 Building NO 11,Chunhui Road,Suzhou Industrial Park,Jiangsu Province,China.

FPC Flexible PCB Laser Cutting Machine- FPC Flexible PCB Laser Cutting Machine Manufacturers, Suppliers and Exporters in www.pcbcutter.com Electronics Production Machinery

在线咨询
Click Refresh Verification Code

Description

FPC Flexible PCB Laser Cutting Machine- FPC Flexible PCB Laser Cutting Machine Manufacturers, Suppliers and Exporters in www.pcbcutter.com Electronics Production Machinery

 Description:

Product Name:
Laser Pcb Separator
Super:
Low Power Consumption
Laser:
12/15/17W
Laser Brand:
Optowave
Power:
220V 380v
Warranty:
1 Year

1. Advantages of Laser Fpc Cutting/singulation:

2. No mechanical stress on substrates or circuits

3. No tooling cost or consumables.

4. Versatility ability to change applications by simply changing settings

5. Fiducial Recognition more precise and clean cut

6. Optical Recognition before PCB depaneling/singulation process begins.

7. Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

8. Extraordinary cut quality holding tolerances as small as < 50 microns.

9. No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

1.Damages and fractures to substrates and circuits due to mechanical stress

2.Damages to PCB due to accumulated debris

3. Constant need for new bits, custom dies, and blades

4. Lack of versatility – each new application requires ordering of custom tools, blades, and dies

5. Not good for high precision, multi-dimensional or complicated cuts

6. Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Specification:

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm


Laser class

1

Max. working area (X x Y x Z)

300 mm x 300 mm x 11 mm

Max. recognition area (X x Y)

300 mm x 300 mm

Max. material size (X x Y)

350 mm x 350 mm

Data input formats

Gerber, X-Gerber, DXF, HPGL,

Max. structuring speed

Depends on application

Positioning accuracy

± 25 μm (1 Mil)

Diameter of focused laser beam

20 μm (0.8 Mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

1000mm*940mm
*1520 mm

Weight

~ 450 kg (990 lbs)

Power supply

230 VAC, 50-60 Hz, 3 kVA

Cooling

Air-cooled (internal water-air cooling)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)

Humidity

< 60 % (non-condensing)

Required accessoires

Exhaust unit

PCB Laser Depaneling Machine with UV Laser,YSV-7A Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.


Home
Phone
sms
Contact